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Mounting capability   
     Mounting accuracy:20 um    

     Component size:0.4×0.2mm(01005) —130×79mm,Flip-CHIP,QFP,BGA,POP    

     Maximum element height:25mm    

     Maximum PCB size:680×500mm    

     Minimum PCB size:unlimited   

     PCB thickness:0.3 to 6mm    

        PCB weight:3KG    

Wave soldering
     Maximum width of PCB:450mm    

     Minimum PCB width:unlimited     

     Element height:upper 120mm/Below 15mm    

     Product technology: local metal base, whole plate metal base, embedded metal base, step metal base  

     Metal base materials: aluminum base, copper base   

     Metal base surface treatment: silver plating, gold plating   

      Sintering bubble rate: no more than 20%   

Back plate crimping
     Pressure range:0-50KN    

     Maximum size of crimped PCB:800X600mm    

Test capability
     ICT test, flying needle test, aging test, function test, temperature cycling